Enquiry on Projects funded
under the BUD Fund (Organisation Support Programme)

Project Details
Project Reference : BUD162010  
English Title : To strengthen the capability of local inventors and enhance opportunity of local invention and innovative ideas towards successful business in domestic market  
Chinese Title : 提升本地發明家之能力及提供發展機會予本地發明及創新意念以邁向內地市場  
Target Sector : Other manufacturing industries
Chemical and biotechnology
Environmental Industries
Information technology
Project Objective : Branding & Domestic Sales  
Project Nature : Promotional activities/competitions/awards
Project Deliverables : (i) An online patent platform on Mainland patents owned by Hong Kong enterprises under four technology areas;

(ii) Five Hong Kong pavilions in Mainland exhibitions, with five business matching sessions organised during the exhibitions;

(iii) Five seminars on patent commercialisation in the Mainland;

(iv) Four directories on patents owned by Hong Kong enterprises;

(v) Project webpages, an enquiry email and hotline; and

(vi) A series of promotional activities (including leaflets, posters and advertisements).  
Project Duration (Months) : 30  
Commencement Date : 20/02/2017 (dd/mm/yyyy)
Completion Date : 19/08/2019 (dd/mm/yyyy)
Grantee : Hong Kong Federation of Invention and Innovation Limited  
Collaborating Organisation(s) : The Chinese Manufacturers' Association of Hong Kong
Hong Kong Foundry Association Limited
Hong Kong Federation of Innovative Technologies and Manufacturing Industries Limited
Hong Kong Auto Parts Industry Association Limited
Hong Kong Brands Protection Alliance Limited
Hong Kong Surface Finishing Society Limited
The Hong Kong General Chamber of Commerce
Hong Kong Trade Development Council
Federation of Hong Kong Industries
Hong Kong Institute of Patent Attorneys Limited
Asian Licensing Association Company Limited
Hong Kong Small & Medium Enterprises Development Federation Limited
Industrial Designers Society of Hong Kong Limited
Implementation Agent(s) : Hong Kong Productivity Council
Fund Approved : HK$ 3,484,722