Enquiry on Projects funded
under the BUD Fund (Organisation Support Programme)
Project Details
Project Reference :
BUD164004
English Title :
Demonstrate the collective image of high value-added and superb technique of Hong Kong Printed Circuit Board (PCB) manufacturing in emerging products category to extend the South China market
Chinese Title :
展現香港綫路板製造商於高增長產品範疇的高增值及優越技術優勢，以擴展南中國市場
Target Sector :
Electronics
Project Objective :
Branding & Domestic Sales
Project Nature :
Promotional activities/competitions/awards
Project Deliverables :
(i) Two pavilions with industrial forums and networking events at the International Printed Circuit & APEX South China Fair 2017 and 2018 to promote the collective image of Hong Kong’s PCB manufacturing industry and update the industry on the business environment of PCB manufacturing in southern China ;
(ii) A promotional video to demonstrate the strengths of Hong Kong PCB manufacturers;
(iii) Two editorial articles to promote the Hong Kong PCB industry to potential Mainland buyers.
Project Duration (Months) :
21
Commencement Date :
15/07/2017 (dd/mm/yyyy)
Completion Date :
14/04/2019 (dd/mm/yyyy)
Grantee :
Hong Kong Printed Circuit Association Limited
Collaborating Organisation(s) :
The Hong Kong Electronic Industries Association Limited
Hong Kong Electrical Appliance Industries Association Limited
Implementation Agent(s) :
Hong Kong Productivity Council
Fund Approved :
HK$ 1,101,200